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Laser-Induced Electrolytic Seeding of Epoxy Glass Composites for Electroless Copper Deposition

IP.com Disclosure Number: IPCOM000103427D
Original Publication Date: 1990-Nov-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 54K

Publishing Venue

IBM

Related People

Ballard, GL: AUTHOR [+4]

Abstract

Disclosed is a method for preparing epoxy glass composites for electroless copper plating. The method involves using a laser to create a conductive film in the epoxy glass, flash electrolytic plating of nickel for seeding, followed by electroless copper plating.

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Laser-Induced Electrolytic Seeding of Epoxy Glass Composites for Electroless Copper Deposition

      Disclosed is a method for preparing epoxy glass composites for
electroless copper plating.  The method involves using a laser to
create a conductive film in the epoxy glass, flash electrolytic
plating of nickel for seeding, followed by electroless copper
plating.

      Printed circuit boards typically consist of layers of glass
cloth bound together with epoxy.  Circuit lines are created on the
boards with photolithographic processes and either subtractive metal
etching or metal plating. Described below is a method for creating
circuit lines on epoxy glass composites in general and printed
circuit boards in particular.  Photoresists are not required to
define the circuit patterns in the disclosed method.

      The epoxy glass composite is placed in an appropriate fixture
and is exposed to an excimer laser beam of sufficient fluence
(energy/cm2) to ablate the epoxy. Complete ablation of the epoxy
exposes the glass cloth to the excimer laser beam.  A conductive film
is produced on the glass cloth by the action of the excimer laser.
Circuit patterns of conductive film are defined by turning the
excimer beam on and off while the epoxy glass composite is scanned
underneath the beam.  An alternative method for defining the circuit
patterns is to scan the excimer beam across the epoxy glass
composite.

      Electrical contact is made with the conductive film...