Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Decoupling Capacitor Attachment Method

IP.com Disclosure Number: IPCOM000103428D
Original Publication Date: 1990-Nov-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 31K

Publishing Venue

IBM

Related People

Malack, JA: AUTHOR

Abstract

Electric decoupling between unlike voltage planes in multilayer printed circuit boards is achieved by soldering decoupling capacitors on the X-Y surface of the board. The capacitors require significant space. The demand for surface space is constantly increasing due to increase in physical size of logic modules which are also attached to the X-Y surface.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Decoupling Capacitor Attachment Method

      Electric decoupling between unlike voltage planes in multilayer
printed circuit boards is achieved by soldering decoupling capacitors
on the X-Y surface of the board.  The capacitors require significant
space.  The demand for surface space is constantly increasing due to
increase in physical size of logic modules which are also attached to
the X-Y surface.

      Significantly more space is made available on the X-Y surface
of multilayer printed circuit boards by mounting electrical noise
control decoupling capacitors along the side edge of the circuit
board.

      In the figure, capacitor 1 is soldered to voltage tabs 2
corresponding to different voltage levels 3 which are brought out to
the side edge of the circuit board 4. Functional value is now
provided by the side edge. Previously, the side edge provided no
value.  Capacitors can be mounted along the entire board perimeter.

      Disclosed anonymously.