Browse Prior Art Database

Applying Thermal Transfer Compound Under Quadpacks

IP.com Disclosure Number: IPCOM000103434D
Original Publication Date: 1990-Nov-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 23K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR [+2]

Abstract

The application of thermal transfer compound under quadpacks prior to soldering results in the problems of quadpack seating, lead location accuracy, contaminated solder joints and compound curing prior to flux removal. A method of applying thermal transfer compound under quadpacks after quadpack soldering overcomes these problems. The thermal transfer compound 1 is injected through plated through holes 2 of the printed wiring board 3 that are centered under the quadpack 4 body. (Image Omitted)

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Applying Thermal Transfer Compound Under Quadpacks

      The application of thermal transfer compound under quadpacks
prior to soldering results in the problems of quadpack seating, lead
location accuracy, contaminated solder joints and compound curing
prior to flux removal.  A method of applying thermal transfer
compound under quadpacks after quadpack soldering overcomes these
problems.  The thermal transfer compound 1 is injected through plated
through holes 2 of the printed wiring board 3 that are centered under
the quadpack 4 body.

                            (Image Omitted)

      Disclosed anonymously.