Browse Prior Art Database

Vapor Phase Leveling of Predeposited Solder

IP.com Disclosure Number: IPCOM000103435D
Original Publication Date: 1990-Nov-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 25K

Publishing Venue

IBM

Related People

Bender, TK: AUTHOR [+2]

Abstract

Predeposited solder applied to surface mount technology printed wiring board surface circuitry is typically crowned. Crowned solder configurations contribute to electronic device rotation and X-Y shift during device soldering operations. Converting solder crowns to flat surfaces prior to device soldering eliminates these problems. A method to perform this conversion is to place a stepped weight 1 on the crowned solder 2 that is on the surface circuitry 3 of the printed wiring board 4 and pass the assembly through a vapor phase soldering cycle. The dimension of gap 5 determines the dimensional reduction of the solder crowns. (Image Omitted)

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Vapor Phase Leveling of Predeposited Solder

      Predeposited solder applied to surface mount technology printed
wiring board surface circuitry is typically crowned. Crowned solder
configurations contribute to electronic device rotation and X-Y shift
during device soldering operations.  Converting solder crowns to flat
surfaces prior to device soldering eliminates these problems.  A
method to perform this conversion is to place a stepped weight 1 on
the crowned solder 2 that is on the surface circuitry 3 of the
printed wiring board 4 and pass the assembly through a vapor phase
soldering cycle.  The dimension of gap 5 determines the dimensional
reduction of the solder crowns.

                            (Image Omitted)

      Disclosed anonymously.