Browse Prior Art Database

Ceramic Planarizing Layer

IP.com Disclosure Number: IPCOM000103456D
Original Publication Date: 1990-Nov-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 38K

Publishing Venue

IBM

Related People

Jones, F: AUTHOR [+4]

Abstract

Disclosed is a method of planarizing ceramics that (1) provides a smooth surface for the wiring of multilayer metal/polymer structures and (2) effectively seals the substrate to wet chemical etching processes.

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Ceramic Planarizing Layer

      Disclosed is a method of planarizing ceramics that (1) provides
a smooth surface for the wiring of multilayer metal/polymer
structures and (2) effectively seals the substrate to wet chemical
etching processes.

      When connections are made between ceramic/metal structures and
metal wiring structures, several conditions need to be satisfied: (1)
the ceramic/metal area needs to be impervious to fluids, and (2) the
surface of the ceramic layer must be smooth.

      It was discovered that a layer of ceramic coated atop the
metal-ceramic structure by reactive sputter deposition can
subsequently be planarized by means of a mechanical polishing
process.  In particular, an alumina ceramic substrate was coated with
16 microns of sputtered aluminum oxide which was then polished.  On
comparing the roughness of polished alumina ceramic substrates with
and without the sputtered aluminum oxide overcoat, it was found that
under the same polishing conditions, the roughness of the aluminum
oxide coated substrates was much less than that of the substrates
that were not coated with aluminum oxide.

      Prior to polishing, the sputtered alumina substrates were baked
for at least 4 hours.  The deposited film exhibited no cracking or
spalling.  This indicated that the adhesion of the deposited film to
the substrate was excellent.

      Disclosed anonymously.