Browse Prior Art Database

Preloaded Leads to Facilitate Solderability

IP.com Disclosure Number: IPCOM000103458D
Original Publication Date: 1990-Nov-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 32K

Publishing Venue

IBM

Related People

Hernandez, B: AUTHOR [+4]

Abstract

A nest used to hold a substrate and multiple pieces of flex is shown in the drawing below. This nest is accurately machined to allow the substrate to fit securely and has vacuum slots and holes to receive locating pins for each flex to be located in a dead-reckoning scheme. Due to uncontrollable variables such as solder heights and substrate thicknesses an angle machined in the area of the nest that receives the flex will preload the cantilevered beam portion of the flex. This area is specifically called out in the drawing and will assure that each lead is in contact with a mating solder pad prior to reflow.

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Preloaded Leads to Facilitate Solderability

      A nest used to hold a substrate and multiple pieces of flex is
shown in the drawing below.  This nest is accurately machined to
allow the substrate to fit securely and has vacuum slots and holes to
receive locating pins for each flex to be located in a dead-reckoning
scheme.  Due to uncontrollable variables such as solder heights and
substrate thicknesses an angle machined in the area of the nest that
receives the flex will preload the cantilevered beam portion of the
flex.  This area is specifically called out in the drawing and will
assure that each lead is in contact with a mating solder pad prior to
reflow.

      Disclosed anonymously.