Browse Prior Art Database

Positive Planarity Mechanism for Large Substrate Nest

IP.com Disclosure Number: IPCOM000103459D
Original Publication Date: 1990-Nov-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 44K

Publishing Venue

IBM

Related People

Hernandez, B: AUTHOR [+4]

Abstract

This invention will provide a means to allow large substrates with variable thicknesses to be brought into contact with a previously held flex interconnect. By positive displacement in the 'Z' direction, complete contact is made between these flexes and the mating substrate irregardless of the substrate thickness.

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Positive Planarity Mechanism for Large Substrate Nest

      This invention will provide a means to allow large substrates
with variable thicknesses to be brought into contact with a
previously held flex interconnect.  By positive displacement in the
'Z' direction, complete contact is made between these flexes and the
mating substrate irregardless of the substrate thickness.

      The drawing shows a cut away view of the substrate nest with
particular emphasis on the cavities which contain .125 inch diameter
stainless steel balls.  The substrate will be loaded into the central
area of the nest with the balls in a fully retracted position.  Four
flexes are then aligned with a pin in hole positive location scheme
with vacuum applied to the backside of the individual flexes.  At
this point the substrate is aligned correctly in both X and Y but the
flexes are cantilevered over the substrate.  A prescribed flow of
gas, in this case Nitrogen, is now allowed to enter the central
cavity which, in turn, routes the gas into four cylindrical holes
containing .125 inch diameter stainless steel balls.  These balls, in
turn, elevate each corner of the substrate until the carriers' Z
movement is impeded by the counterforce applied by the flexes
themselves.

      Disclosed anonymously.