Browse Prior Art Database

Etch Pattern in Copper Locates Chip for Soldering

IP.com Disclosure Number: IPCOM000103465D
Original Publication Date: 1990-Dec-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Related People

Hebert, T: AUTHOR

Abstract

A small high wattage chip is positioned on a large copper pad for heat distribution which makes it difficult to hold location in the solder reflowed operation. Precision is required to make use of automatic wire bonding.

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This is the abbreviated version, containing approximately 100% of the total text.

Etch Pattern in Copper Locates Chip for Soldering

      A small high wattage chip is positioned on a large copper pad
for heat distribution which makes it difficult to hold location in
the solder reflowed operation.  Precision is required to make use of
automatic wire bonding.

      Copper is removed at a small area at the corners of the chip
site to allow the surface tension of the solder to align the chip as
the figure indicates.

      Disclosed anonymously.