Browse Prior Art Database

Close Proximity 2-Sided In-Hole Assembly

IP.com Disclosure Number: IPCOM000103466D
Original Publication Date: 1990-Dec-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 29K

Publishing Venue

IBM

Related People

Hebert, TM: AUTHOR [+2]

Abstract

With pin-in-hole components on two sides of a printed circuit board, soldering the second side is difficult. The Air-Vac solder fountain (Trademark of Air-Vac, Co., Milford, Conn.) is the normal assembly method. Large multilayer, fully populated cards warp when localized heat is applied. This allows solder access to the back side of the pin grid array.

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Close Proximity 2-Sided In-Hole Assembly

      With pin-in-hole components on two sides of a printed circuit
board, soldering the second side is difficult.  The Air-Vac solder
fountain (Trademark of Air-Vac, Co., Milford, Conn.) is the normal
assembly method.  Large multilayer, fully populated cards warp when
localized heat is applied. This allows solder access to the back side
of the pin grid array.

      This problem is solved by placing a spring-loaded collar on the
component side.  Force exerted by the collar is balanced by a support
that was added to the solder fountain tooling as shown in the figure.
The control of the warpage allows defect-free assembly.

      Disclosed anonymously.