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Browse Prior Art Database

Fine Pitch Cable/Connector Attachment Method

IP.com Disclosure Number: IPCOM000103469D
Original Publication Date: 1990-Dec-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Gutierrez, BL: AUTHOR

Abstract

Disclosed is a method to attach cables or connectors to cards by the use of individual solder particles of 0.004-0.008" diameter (70-150 mesh) to provide the solder volume required.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Fine Pitch Cable/Connector Attachment Method

      Disclosed is a method to attach cables or connectors to cards
by the use of individual solder particles of 0.004-0.008" diameter
(70-150 mesh) to provide the solder volume required.

      The solder alloy can be tin/lead, tin/bismuth, tin/antimony or
other generally available solder powder. The flux can be rosin-based,
water-soluble, or no-clean; its primary purpose is to provide tack.
The exact alloy and flux combination are chosen by the requirements
of the assembly process.  Compatible reflow methods include hot gas,
focused IR, or laser reflow for localized attachment. This method
avoids exposing cards to plating chemicals and can be used on very
fine pitch pads where dip soldering, partial wave, or solder paste
cannot be used.

      PROCESS:
1.   Apply flux by spraying or dispensing onto card or cable/
connector.
2.   Adhere layer of solder particles to flux
3.   (Optional) Reflow solder using localized or mass heating.  Else
dry flux at 50-100oC to securely hold solder particles.
4.   Apply flux to card or cable/connector surface with reflow solder
or other solderable surface.
5.   Position cable/connector on pads on card.
6.   Reflow solder using localized or general heating.

      Disclosed anonymously.