Browse Prior Art Database

Large Grid Array Module Rework Fixture

IP.com Disclosure Number: IPCOM000103471D
Original Publication Date: 1990-Dec-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 49K

Publishing Venue

IBM

Related People

Brown, DH: AUTHOR [+3]

Abstract

Described herein is a tool developed to facilitate rework of large pin grid array modules on printed circuit boards by minimizing thermal distortion caused by the application of localized heat. It is a spring-loaded device aligned to the module being removed and secured to the PCB. The actuator is preloaded to the REMOVE position and the entire assembly is processed at a solder reflow device (optional). As the solder reflows, the module is released from the board and held above the site until it is removed from the carrier and a good module is replaced in the carrier. The actuator is now preloaded to the REPLACE position and upon reflow the module will be properly inserted. The optional solder reflow device may be SOLDERWAVE, IR or VAPORPHASE depending on the restrictions imposed by the components.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Large Grid Array Module Rework Fixture

      Described herein is a tool developed to facilitate rework of
large pin grid array modules on printed circuit boards by minimizing
thermal distortion caused by the application of localized heat. It is
a spring-loaded device aligned to the module being removed and
secured to the PCB. The actuator is preloaded to the REMOVE position
and the entire assembly is processed at a solder reflow device
(optional). As the solder reflows, the module is released from the
board and held above the site until it is removed from the carrier
and a good module is replaced in the carrier. The actuator is now
preloaded to the REPLACE position and upon reflow the module will be
properly inserted. The optional solder reflow device may be
SOLDERWAVE, IR or VAPORPHASE depending on the restrictions imposed by
the components.

      Depicted below is the bidirectional spring-loaded module
carrier, the associated supports and a 64 mm module.

      Disclosed anonymously.