Browse Prior Art Database

TAB Mass Reflow with Component Placed in Paste and Held in Place with a Holding Ring

IP.com Disclosure Number: IPCOM000103472D
Original Publication Date: 1990-Dec-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Related People

Yu, S: AUTHOR

Abstract

Described is a method for TAB mass reflow which includes applying pre-heat during component placement to help hold leads down in solder paste. Using a non-wettable titanium ring to hold component in place with weight during mass reflow gives satisfactory solder joints. Solder joints are formed even for leads which are not in contact with paste after placement.

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TAB Mass Reflow with Component Placed in Paste and Held in Place with a Holding Ring

      Described is a method for TAB mass reflow which includes
applying pre-heat during component placement to help hold leads down
in solder paste.  Using a non-wettable titanium ring to hold
component in place with weight during mass reflow gives satisfactory
solder joints.  Solder joints are formed even for leads which are not
in contact with paste after placement.

      The holding ring (Fig. 1) can be made of any non-wettable
material of appropriate weight.  The dimension of the ring is
tailored to cover the portion of component leads which are in contact
with paste.  The weight and dimension of the ring can be optimized
depending on the type of components and mass reflow processes.

      Disclosed anonymously.