Browse Prior Art Database

Socket for Plastic Modules Having High Lead Count

IP.com Disclosure Number: IPCOM000103475D
Original Publication Date: 1990-Dec-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 38K

Publishing Venue

IBM

Related People

Beaulieu, PE: AUTHOR

Abstract

By using inherent accuracy of leadframe technology, an electrical module socket is constructed to reliably make contact with the large number of leads coming out of small plastic module circuit packages.

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This is the abbreviated version, containing approximately 100% of the total text.

Socket for Plastic Modules Having High Lead Count

      By using inherent accuracy of leadframe technology, an
electrical module socket is constructed to reliably make contact with
the large number of leads coming out of small plastic module circuit
packages.

      Referring to the figure, molded plastic circuit module 2 having
external spring leads 4 is forced downward and held in place by any
of several spring and latch mechanisms. Positioning of module 2 in
the horizontal plane of module socket 6 is accomplished by means,
e.g., tapered corner guides or taper pins.  These locating means,
which are a part of module socket 6, are positioned accurately
relative to cantilevered spring contacts 8.  Spring contacts 8 are
made by lead frame technology and are molded or glued in place to
become a permanent part of module socket 6. Extensions of contacts 8
are bent downward and in staggered positions to become push-pin leads
to a printed circuit card level (not shown).  Push-pin portions of
leads 8 are held in their final position and cast or potted in
plastic 10 which surrounds and becomes a solid part of module socket
6.

      Disclosed anonymously.