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Browse Prior Art Database

Pin Tinning/Soldering Process

IP.com Disclosure Number: IPCOM000103487D
Original Publication Date: 1990-Dec-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 47K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR [+3]

Abstract

Soldering symetrical, gold-plated I/O pins in a matrix, to a printed wiring board with a high solder joint reliability requirement can be accomplished as follows. (Image Omitted)

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Pin Tinning/Soldering Process

      Soldering symetrical, gold-plated I/O pins in a matrix, to a
printed wiring board with a high solder joint reliability requirement
can be accomplished as follows.

                            (Image Omitted)

      Solder mask 1 is assembled to printed wiring board 2.
Encapsulant barrier 3 is assembled to printed wiring board 2.  Pin
matrix of pins 4 is loaded into the plated through holes of printed
wiring board 2.  Pin protrusion length is controlled by a removable
mechanical pin stop at the dotted line.  The pin matrix is
encapsulated with removeable encapsulant 5 and cured.  The removeable
mechanical pin stop is removed.  Pins 4 are fluxed and hot solder
dipped to remove the gold plating from the pins 4 in the soldering
section of pin.  The pin matrix, encapsulant barrier 3 and
encapsulant 5 are raised by pushing tips of pins 4 until the pin tips
are flush with solder mask 1.  Solder mask 1 is removed.  Spacers are
inserted between printed wiring board 2 and encapsulant barrier 3.
Pin matrix, encapsulant barrier 3 and encapsulant 5 are lowered until
encapsulant barrier 3 rests on the spacers controlling pin protrusion
on both sides of the assembly.  The solder dipped pins 4 are mass
soldered to printed wiring board 2.  Encapsulant 5 and encapsulant
barrier 3 are removed to complete the assembly.

      Disclosed anonymously.