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Direct Liquid Cooling of Computer Chips using a Densely Packed Pin Fin Array and Controlled Radial Flow of a Dielectric Coolant

IP.com Disclosure Number: IPCOM000103496D
Original Publication Date: 1990-Dec-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 51K

Publishing Venue

IBM

Related People

Chrysler, GM: AUTHOR [+4]

Abstract

Computer chips are attached to a substrate in a row and column array, as is conventional. An array of cylindrical pins (fins) 1 is held over each chip 3 by a retainer 5. The retainer 5 fixes the lateral position of each pin 1 over the surface of a chip 3, but permits vertical adjustment to local variations in chip tilt and height. The retainer 5 also contains a plenum 6 and nozzle 7. A resilient elastomer layer 4 holds the pins 1 against the chip 3. The resilient layer 4 is either bonded to the pins 1 or lies between the retainer 5 and a pin surface formed by a reduction in the pin diameter. This resilient layer 4 is compressed when the cooling apparatus is positioned over the chips and joined to the substrate. The pins 1 are thereby held in direct contact with a chip 3 by a predetermined force.

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Direct Liquid Cooling of Computer Chips using a Densely Packed Pin Fin Array and Controlled Radial Flow of a Dielectric Coolant

      Computer chips are attached to a substrate in a row and column
array, as is conventional.  An array of cylindrical pins (fins) 1 is
held over each chip 3 by a retainer 5.  The retainer 5 fixes the
lateral position of each pin 1 over the surface of a chip 3, but
permits vertical adjustment to local variations in chip tilt and
height.  The retainer 5 also contains a plenum 6 and nozzle 7.  A
resilient elastomer layer 4 holds the pins 1 against the chip 3.  The
resilient layer 4 is either bonded to the pins 1 or lies between the
retainer 5 and a pin surface formed by a reduction in the pin
diameter.  This resilient layer 4 is compressed when the cooling
apparatus is positioned over the chips and joined to the substrate.
The pins 1 are thereby held in direct contact with a chip 3 by a
predetermined force.  A soft metal is deposited at the tip 2 of each
pin 1 to insure good thermal contact between the chip 3 and pins 1.

      A dielectric coolant (designated by arrows) supplied to the
plenum flows into the nozzle 7 and impinges on the chip 3.  Heat is
partially removed directly from the exposed surfaces of each chip 3
by the impinging flow of the dielectric liquid, such as a
fluorocarbon or liquid nitrogen.  In addition, heat is conducted from
the chip 3 into each of the pins 1 and is dissipated to the fluid
flowing over the pins...