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A Lower-Cost, High-Performance Thin Core Substrate

IP.com Disclosure Number: IPCOM000103507D
Publication Date: 2005-Mar-18
Document File: 2 page(s) / 63K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a new thin core substrate that has laser drilled outer core layers for improved stiffness, reduced core drilling costs, and improved droop performance.

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A Lower-Cost, High-Performance Thin Core Substrate

Disclosed is a method for a new thin core substrate that has laser drilled outer core layers for improved stiffness, reduced core drilling costs, and improved droop performance.

Background

The POR substrate uses a thick (~ 800-700 um) core with 300-250 um plated through holes (PTH) drilled through the core. This increases the loop inductance of the substrate and has a detrimental impact on the first droop. Simulations show that reducing the core thickness and the PTH pitch improve the first droop performance. In addition, the PTH pitch diminishes when reducing the core thickness, which means that a thin core substrate has a lower loop inductance than the thicker core substrate. However, from a manufacturing prospective the fine pitched plated through hole (FP-PTH) calls for a small PTH diameter (100-120 um). This impacts the substrate manufacturing cost by increasing the PTH drilling process cost (PTH drilling is already the most expensive substrate manufacturing cost); it also reduces throughput, yield, and limits the copper thickness that can be plated on the inner core layer. On other hand, thin core substrates can further improve the electrical performance of FP-PTH. The thin package with a thin core has reliability and assembly concerns, mainly due to increased warpage and the impact on second-level integration and reliability.

General Description

The disclosed method presents a thin core substrate with laser drilled prepreg 1F/1B layers for increased stiffness, reduced PTH mechan...