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High Temperature Lift Off for Oxide Superconductors

IP.com Disclosure Number: IPCOM000103573D
Original Publication Date: 1993-Jan-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 2 page(s) / 73K

Publishing Venue

IBM

Related People

Chance, DA: AUTHOR [+2]

Abstract

A lift-off structure and process is disclosed for the deposition of patterned thin film and thermal treatment above 900oC. It offers the advantage of minimum processing following deposition. The process is particularly important for patterning high-temperature superconductors.

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This is the abbreviated version, containing approximately 65% of the total text.

High Temperature Lift Off for Oxide Superconductors

       A lift-off structure and process is disclosed for the
deposition of patterned thin film and thermal treatment above 900oC.
It offers the advantage of minimum processing following deposition.
The process is particularly important for patterning high-temperature
superconductors.

      The usual lift-off process using photoresist materials is not
suitable for high-temperature superconductors since they cannot be
exposed to temperatures above 500oC.  Another deficiency is that
organic materials require relatively harsh chemicals (i.e., toward
oxide superconductors) for removal of the lift-off structure.  Both
of these problems are avoided by the use of inorganic materials which
can withstand temperatures to 900oC but at least one of which is
water soluble to facilitate removal of the lift-off structure.  Fig.
1 shows the proposed lift-off structure.  Layer (A) consists of a
water soluble and low vapor pressure halide with melting point well
above 800oC.  It can be deposited by the usual thin film techniques,
such as evaporation or sputtering.  Possible candidate materials are
listed in Table 1.  Layer B may be one or a combination of several
noble metals since they will be exposed to oxygen at high
temperatures.  The metals Ag, Au, Pd, etc., are proposed, and they
may also be deposited by the usual methods, such as evaporation or
sputtering.

      The typical process steps for the deposition and p...