Browse Prior Art Database

Metallization Process for Green Ceramic Sheets

IP.com Disclosure Number: IPCOM000103603D
Original Publication Date: 1993-Jan-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Related People

Chance, DA: AUTHOR [+2]

Abstract

The forming of conductors of small cross section (1 mil2) on a green ceramic sheet for multilayer ceramic modules is disclosed by preforming the circuit lines on a release sheet for later transfer to the green sheet. The circuit lines are powder-filled epoxy, but solid metal may be used for glass-ceramic with zero lateral shrinkage during densification. This technique offers improved line integrity, progressive inspection and greater yield for fine lines.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 79% of the total text.

Metallization Process for Green Ceramic Sheets

       The forming of conductors of small cross section (1 mil2)
on a green ceramic sheet for multilayer ceramic modules is disclosed
by preforming the circuit lines on a release sheet for later transfer
to the green sheet.  The circuit lines are powder-filled epoxy, but
solid metal may be used for glass-ceramic with zero lateral shrinkage
during densification.  This technique offers improved line integrity,
progressive inspection and greater yield for fine lines.

      Referring to Fig. 1, a flexible sheet 1, such as
polytetrafluoroethylene, having thin, dried release coating 2
thereon, for example, polyimide, is provided with locating holes 3
and laminated with a dry film photoresist 4.  The photoresist is
exposed and developed to form the desired circuit line pattern.  The
pattern is filled by squeegee 5 with metal-filled epoxy paste and
cured to provide rigid or semi-rigid circuit lines 6, and the
photoresist is dissolved.

      Alternately, the flexible sheet 1 with release coating is
metallized with a thin (< 1 mm) layer prior to lamination of the dry
film resist.  The developed patterns in the resist are then
electroplated to fill the cavities.  The photoresist is dissolved,
and the metal plating base etched away, leaving the desired metal
pattern.

      In Fig. 2, sheet 1 with release coating 2 and circuit lines 6
is aligned on green ceramic sheet 7 having previously filled metal
vias 8 and com...