Browse Prior Art Database

Circuit Test Integral Heat Sink

IP.com Disclosure Number: IPCOM000103746D
Original Publication Date: 1993-Jan-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 53K

Publishing Venue

IBM

Related People

Buller, ML: AUTHOR [+2]

Abstract

Disclosed here is a heat sink built integral to a printed circuit card test bed, which serves to attach heat sinks temporarily for circuit test. Certain kinds of components cannot be tested unless they are attached to heat sinks because they will become too hot and possibly degrade internally. However, it is not desirable to attach heat sinks until after test or repair because of space problems in the testers or because of problems of obtaining sufficient temperature to reflow solder joints during rework.

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Circuit Test Integral Heat Sink

      Disclosed here is a heat sink built integral to a printed
circuit card test bed, which serves to attach heat sinks temporarily
for circuit test.  Certain kinds of components cannot be tested
unless they are attached to heat sinks because they will become too
hot and possibly degrade internally.  However, it is not desirable to
attach heat sinks until after test or repair because of space
problems in the testers or because of problems of obtaining
sufficient temperature to reflow solder joints during rework.

      The attached figure shows an example of the disclosed
tester/heat sink assembly.  When the test bed (1) closes (either
vertically or in clam-shell fashion), the tester heat sink (2) will
contact the required components (3) on board (4), providing the
necessary heat sink capability during testing.  Thermal contact from
the heat sink to the component would be provided through a thermal
gasket material (5), which would also provide some compliance.  If
necessary, the heat sink could be mounted in a compliant mount if
additional compliance were required.

      The figure shows a simple heat sink, integral to the circuit
tester, which directly contacts the component to be cooled.  However,
other embodiments of this disclosure could use a heat pipe or other
conductive medium to transport heat from the component to a heat sink
on the outside of the tester.

      After circuit test and any necessary repair acti...