Browse Prior Art Database

Vacuum Attachment of Heat Sink during Testing

IP.com Disclosure Number: IPCOM000103748D
Original Publication Date: 1993-Jan-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Buller, ML: AUTHOR [+2]

Abstract

Disclosed is a methodology of temporarily attaching a heat sink to a module for the purpose of cooling that module during component test. As shown by the embodiment in the figure, the method is based on the vacuum attachment of an element, referred to here as a manifold, to the module (1) (in this case, an area array pin-through component, or any component which is to be thermally enhanced). The manifold (2) has been formed in such a manner as to generally cover the module or component, so that the vacuum delivered through the connection (3) causes the manifold to adhere to the module or component, while simultaneously permitting a cooling flow around the module or component.

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Vacuum Attachment of Heat Sink during Testing

      Disclosed is a methodology of temporarily attaching a heat sink
to a module for the purpose of cooling that module during component
test.  As shown by the embodiment in the figure, the method is based
on the vacuum attachment of an element, referred to here as a
manifold, to the module (1) (in this case, an area array pin-through
component, or any component which is to be thermally enhanced).  The
manifold (2) has been formed in such a manner as to generally cover
the module or component, so that the vacuum delivered through the
connection (3) causes the manifold to adhere to the module or
component, while simultaneously permitting a cooling flow around the
module or component.  As shown below, one method of allowing the
cooling flow is to provide standoffs (4) in the manifold which
prevent the vacuum from pulling the entire surfaces of the manifold
and component together.

      Disclosed anonymously.