Browse Prior Art Database

Device Junction Temperature Monitoring for Multichip Modules

IP.com Disclosure Number: IPCOM000103752D
Original Publication Date: 1993-Jan-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 53K

Publishing Venue

IBM

Related People

Potter, TP: AUTHOR [+2]

Abstract

Disclosed is a method for monitoring the temperature of each integrated circuit contained on a Multichip Module (MCM) during manufacturing test. This is accomplished by monitoring the electrical characteristics of protect diodes contained on each device.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 91% of the total text.

Device Junction Temperature Monitoring for Multichip Modules

      Disclosed is a method for monitoring the temperature of each
integrated circuit contained on a Multichip Module (MCM) during
manufacturing test.  This is accomplished by monitoring the
electrical characteristics of protect diodes contained on each
device.

      Each input pin on the device contains a protect diode, which is
used to protect the pin from EOS (electrical overstress) and ESD
(electrostatic discharge) (see the figure).  It has been shown that
the I/V (current/voltage) characteristics for such devices has an
approximately linear dependence on temperature, assuming the device
is preconditioned to be forward-biased.  Since testing is typically
performed at a variety of temperatures (e.g., three for military
screening), it is possible to establish the I/V characteristics for
each IC under test, in exactly its specific location.  As each device
is started at a known temperature and then heats up, based upon its
own generation of heat, the actual junction temperature of the device
under test can be dynamically adjusted during test by altering the
applied temperature of the forcing unit appropriately.  Determination
of the I/V characteristics is easily performed by the tester by
forcing a known current and monitoring the resultant voltage to hold
that current.  As the tester can apply such a measurement in a few
milliseconds, collecting this additional data does not adversely
impact produ...