Browse Prior Art Database

Optical Link Card Assembly Process

IP.com Disclosure Number: IPCOM000103788D
Original Publication Date: 1993-Jan-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 53K

Publishing Venue

IBM

Related People

Best, DP: AUTHOR [+4]

Abstract

The equipment and procedure required for securing Optical Link Cards (OLC) to fixtures and/or mother boards is disclosed. This equipment properly positions and seats the OLC into the appropriate mating device.

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This is the abbreviated version, containing approximately 100% of the total text.

Optical Link Card Assembly Process

      The equipment and procedure required for securing Optical Link
Cards (OLC) to fixtures and/or mother boards is disclosed.  This
equipment properly positions and seats the OLC into the appropriate
mating device.

      The tooling disclosed allows for proper attachment of the OLC
to the carrier and/or fixture while preventing damage to either of
the mating parts.  The OLC attachment tool and the OLC clamp fixture
provide proper support of the carrier/fixtures while simultaneously
applying pressure to the OLC and seating it into position on the
appropriate mate.

      The OLCs are manually placed on the carrier/fixture and located
into position.  The seating tool 1 is then actuated and indexes
downward applying pressure on the connectors (see Fig. 1).  This
seats the OLC into the connector mate 2 for the OLC clamp fixture
(see Fig. 2).  Support for the connector is provided by the tooling 3
(shown in both Figs. 1 and 2) to minimize mechanical stresses on the
mating parts and the connectors themselves.

      Disclosed anonymously.