Browse Prior Art Database

Optical Link Card Assembly Process and Tools

IP.com Disclosure Number: IPCOM000103789D
Original Publication Date: 1993-Jan-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 49K

Publishing Venue

IBM

Related People

Best, DP: AUTHOR [+5]

Abstract

The equipment and process required for the removal of J-type clips from the appropriate mating device is disclosed. The equipment shown holds the support employing the J-type clips in position while simultaneously compressing the clips to release them from the mating device.

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This is the abbreviated version, containing approximately 100% of the total text.

Optical Link Card Assembly Process and Tools

      The equipment and process required for the removal of J-type
clips from the appropriate mating device is disclosed.  The equipment
shown holds the support employing the J-type clips in position while
simultaneously compressing the clips to release them from the mating
device.

      The process for removing J-type mechanical clips from a mating
device requires specialized equipment to provide support while
compressing and releasing the clips.  The J-clips are released by
compressing the end of the clip.  Support for both mating devices is
required due to the fact that one device is compressed downwards
while the other device is forced upwards in order to eject.

      The equipment used for removal of J-type clips is shown in the
figure.  The device containing the J-clips is placed on the fixture
and located into position with the J-clips down inside of bushings 1.
The device is then compressed using the clamping arm 2.  The ejector
pins 3 are then actuated upwards to release the clips and push the
device free.

      Disclosed anonymously.