Browse Prior Art Database

Component Lead Forming Process, Particularly Applicable to Laser Receivers

IP.com Disclosure Number: IPCOM000103790D
Original Publication Date: 1993-Jan-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 57K

Publishing Venue

IBM

Related People

Best, DP: AUTHOR [+4]

Abstract

The equipment and process for forming the leads of the optical devices used on Optical Link Cards (OLC) is disclosed. The equipment shown forms the leads into position while preventing damage to the delicate interface between the leads and the actual optical device.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 95% of the total text.

Component Lead Forming Process, Particularly Applicable to Laser Receivers

      The equipment and process for forming the leads of the optical
devices used on Optical Link Cards (OLC) is disclosed.  The equipment
shown forms the leads into position while preventing damage to the
delicate interface between the leads and the actual optical device.

      Optical Link Card assemblies employ optical devices (lasers and
receivers) that are received from the vendor with straight leads cut
to a predetermined length.  In order for the devices to be soldered
to the card assembly, the leads must be formed such that the leads
are all in the same plane and have the required center to center
distances between them.  After forming, the leads also require a
slight downward bend in order to provide a spring load between the
card and the leads.  Also, the leads are attached to the optical
device at a delicate glass interface so stress relief is required in
this tooling to prevent damage to the device.

      The equipment used for forming the leads of the optical devices
is shown in the figure.  The optical device is located in the
locating block 1.  The air press holding the forming tool is then
actuated and the two halves of the die come together.  The spring
clamp 3 makes contact with the upper part of the leads and clamps
them down to provide stress relief during the forming operation.  An
instant later, the forming dies 2 make contact with the rest of the
leads and...