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Enhanced Metal Polymer Adhesion by Heat Treatment for Ti and Cr on Fluorocarbon Polymer Films

IP.com Disclosure Number: IPCOM000103796D
Original Publication Date: 1993-Jan-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 32K

Publishing Venue

IBM

Related People

Chang, C: AUTHOR [+2]

Abstract

In electronic packaging, dielectric layers using polymer films have been commonly employed. The thermal stability of the metal/polymer interfaces, however, has often been a primary concern for the performance and reliability of the parts fabricated. Teflons, or fluorocarbon polymers, have been potential candidates for packaging due to their low dielectric constants of 2.1. We have found that Ti and Cr gave strong adhesion to such polymers. Further enhancement in adhesion, as measured by peel strength, has been observed upon heating the Ti or Cr Teflon structures. For example, peel strengths of 60-80 g/mm have been obtained for the Ti/FEP and Cr/FEP, with FEP being fluoroethylenepropylene polymer. Upon heating to 375oC for 1-2 hrs, peel strengths exceeding 100 g/mm have been obtained.

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Enhanced Metal Polymer Adhesion by Heat Treatment for Ti and Cr on Fluorocarbon Polymer Films

      In electronic packaging, dielectric layers using polymer films
have been commonly employed.  The thermal stability of the
metal/polymer interfaces, however, has often been a primary concern
for the performance and reliability of the parts fabricated.
Teflons, or fluorocarbon polymers, have been potential candidates for
packaging due to their low dielectric constants of 2.1.  We have
found that Ti and Cr gave strong adhesion to such polymers.  Further
enhancement in adhesion, as measured by peel strength, has been
observed upon heating the Ti or Cr Teflon structures.  For  example,
peel strengths of 60-80 g/mm have been obtained for the Ti/FEP and
Cr/FEP, with FEP being fluoroethylenepropylene polymer.  Upon heating
to 375oC for 1-2 hrs, peel strengths exceeding 100 g/mm have been
obtained.

      Disclosed anonymously.