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Wafer Bonding with Diamond Like Carbon Films

IP.com Disclosure Number: IPCOM000103801D
Original Publication Date: 1993-Jan-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 53K

Publishing Venue

IBM

Related People

Hovel, HJ: AUTHOR

Abstract

Disclosed is a structure incorporating diamond-like carbon (DLC) films sandwiched between two regions of single crystal semiconductor. While these DLC films are electrically insulating, they are highly thermally conducting, comparable to Al. They provide far superior heat transmission than SiO2 or Si3N4 films, allowing for higher circuit densities and, if needed, higher chip power operation.

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Wafer Bonding with Diamond Like Carbon Films

      Disclosed is a structure incorporating diamond-like carbon
(DLC) films sandwiched between two regions of single crystal
semiconductor.  While these DLC films are electrically insulating,
they are highly thermally conducting, comparable to Al.  They provide
far superior heat transmission than SiO2 or Si3N4 films, allowing for
higher circuit densities and, if needed, higher chip power operation.

      The advantages of a DLC bond layer in bonded-wafer silicon on
insulator (BSOI) can be obtained in several different configurations.
1) In the first, one or both surfaces of the wafers to be bonded are
coated with DLC  and the wafers are joined (bonded) at room
temperature, followed by annealing at 800-1100oC to strengthen the
bond.  2) In the second, one  wafer coated with DLC is  bonded to
another wafer coated with a thin (circa 100 o) SiO2 or Si3N4 layer to
obtain the electrical insulating benefits of these dielectrics.  The
bond  strength/temperature behavior can also benefit.  3) In the
third, a BPSG (boron-phosphosilicate glass) layer is present on one
of the wafers and a DLC film on the other; this results in greater
bond strength for lower anneal temperatures.  4) In the fourth
embodiment, the DLC layer on one wafer is patterned with SiO2, Si3N4,
or BPSG, for example with stripes of these dielectrics alternated
with stripes of DLC.  When this patterned wafer is bonded to the
second wafer, the bond prop...