Browse Prior Art Database

New Interleaved Tape Recording Head

IP.com Disclosure Number: IPCOM000103886D
Original Publication Date: 1993-Feb-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 2 page(s) / 71K

Publishing Venue

IBM

Related People

Denison, EV: AUTHOR [+3]

Abstract

Described is a method of overlapping read and write elements to achieve a high density recording head without a write efficiency loss or yield impact. Achieving a high-track density, interleaved tape recording head has previously been limited by the area available at the tape to head interface for read and write elements. The prior art describes methods which accept a substantial loss in write efficiency to achieve an interleaved head.

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New Interleaved Tape Recording Head

      Described is a method of overlapping read and write elements to
achieve a high density recording head without a write efficiency loss
or yield impact.  Achieving a high-track density, interleaved tape
recording head has previously been limited by the area available at
the tape to head interface for read and write elements.  The prior
art describes methods which accept a substantial loss in write
efficiency to achieve an interleaved head.

      Fig. 1 is a composite mask layout of an interleaved recording
head utilizing this idea.  In this figure only, the MR read element
(1) is filled in to illustrate the location of the read tracks.  The
write track width (2) is located between the read tracks but the
write coils can occupy the entire horizontal surface of the chip.  It
is this method of overlapping the write coils, on the read elements,
which is the main feature of this disclosure.  Fig. 1 shows the close
proximity of the read coils (3).  This layout provides a substantial
rear gap area for write-head efficiency and reduces write-coil
resistance, whereas prior art attempted to fit the coil and closure
into the region between the reads, resulting in low-write efficiency
and high-coil resistance.

      Fig. 2 shows the P2 NiFe layer which provides the write closure
(4), read shield (5), and write coil crossover (6) in a single mask.
Fig. 3 shows a cross-section through the center of the write element
to clarify...