Browse Prior Art Database

Multi-Component Pick, Place and Attach Hat

IP.com Disclosure Number: IPCOM000103918D
Original Publication Date: 1993-Feb-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Flint, EB: AUTHOR [+5]

Abstract

Solid state lasers have extremely small mirrors (A similar 10 sup -5 mm sup 2) but very large optical power densities (P/A similar 3x10 .sup 5 mW/mm .sup 2). It is, therefore, imperative that the mirrors be kept clean during the packaging process.

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Multi-Component Pick, Place and Attach Hat

      Solid state lasers have extremely small mirrors (A similar 10
sup -5 mm sup 2) but very large optical power densities (P/A similar
3x10 .sup 5 mW/mm .sup 2).  It is, therefore, imperative that the
mirrors be kept clean during the packaging process.

      Laser packaging may use either back bonding or flip-chip
technologies.  While back bonded techniques can use Au/Sn solder,
some packages do not permit the temperatures that the Au/Sn solders
require for reflow.  Lower melting temperature solders, such as those
found in the  Pb/Sn  alloy system, reduce the processing temperatures
that the device and package are exposed to but normally require the
use of flux to remove the solder oxides during the solder attach.
This flux leaves residues which can alter the reflectivity of the
laser facets and hence the laser's performance characteristics, and
introduces absorption sites which can cause excessive heating of the
facet mirrors.  The use of the hot air thermode provides a reducing,
reflow  atmosphere  during  the chip attach which eliminates the need
for flux and, therefore, minimizes the contamination of the critical
laser mirrors.

A typical attach cycle would consist of the following steps:

1.  Place the Thin Film Carrier in the target area either by
    microscope or video camera and monitor.

2.  Load components face down in the nest and apply vacuum.

3.  A linear slide mechanism is activated which bring...