Browse Prior Art Database

Removal of Polyimide Laser Etch Debris by Wet Etching

IP.com Disclosure Number: IPCOM000103961D
Original Publication Date: 1993-Feb-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Feger, C: AUTHOR [+4]

Abstract

Disclosed is a process to remove debris produced during laser etching of polyimides like PMDA-ODA (Kapton*, PI2545).

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Removal of Polyimide Laser Etch Debris by Wet Etching

      Disclosed is a process to remove debris produced during laser
etching of polyimides like PMDA-ODA (Kapton*, PI2545).

      Laser etching of polyimides produces a carbonatious,
electrically conducing material which covers the walls and the bottom
of laser drilled holes.  Such residues can be detrimental in
subsequent processing.  Thus, removal of this debris is necessary.

      One possible way is based on a wet etch process using a KOH/K
sub 2CO sub 3 solution.  The process follows typical polyimide etch
procedures, however, at usually lower temperatures and
concentrations.   The concentrations of the two components in the
etch solution can vary widely.  Although aqueous KOH alone will work
also, it tends to widen the laser drilled holes, a process not
observed using the mixture described above.

*  Trademark of E. I. du Pont de Nemours & Co.