Browse Prior Art Database

Method for Improved Resist Adhesion to Perfluorinated Materials

IP.com Disclosure Number: IPCOM000103970D
Original Publication Date: 1993-Feb-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Bickford, HR: AUTHOR [+6]

Abstract

Fluorocarbon polymeric materials having an inherent low dielectric constant are of considerable interest as dielectrics in electronic packaging applications because of the demands for increased circuit density and signal propagation. These materials often possess a low surface energy which results in poor adhesion to metals and polymers.

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Method for Improved Resist Adhesion to Perfluorinated Materials

      Fluorocarbon polymeric materials having an inherent low
dielectric constant are of considerable interest as dielectrics in
electronic packaging applications because of the demands for
increased circuit density and signal propagation.  These materials
often possess a low surface energy which results in poor adhesion to
metals and polymers.

      A very desirable method for circuitization of packaging
structures involves additive electroless plating.  This can be
accomplished by depositing a catalytic "seed" layer onto the
dielectric substrate followed by imaging a resist layer to define the
areas to be metallized.  This approach requires good adhesion between
the resist and dielectric surface especially when fine dimension
patterns are imaged and electrolessly plated.

      Described is a process by which the surface of perfluorinated
polymer dielectrics can be treated to improve dry film resist
adhesion such that 0.5 to 2&mu.m resist features can be imaged and
reliably metallized.  The process involves direct electrochemical or
chemical reduction of the polymer surface in an electrolyte solution
to result in both a chemical and morphological change of the
fluoropolymer surface.  Chemical surface reduction can be done by
exposing the material to a solution alkali metal, alkali
metal-aromatic complex salt, or electrochemically generated organic
anionic compounds in aprotic solutions.  Th...