Browse Prior Art Database

Thermally Enhanced Ultrasonic Wire Bonding

IP.com Disclosure Number: IPCOM000104028D
Original Publication Date: 1993-Feb-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 26K

Publishing Venue

IBM

Related People

Ventimiglia, B: AUTHOR [+2]

Abstract

Disclosed is a method to heat an ultrasonic wire bonding tool to enhance the weld quality between the members to be joined; in this particular case we refer to the joining of a wire to a substrate surface which is used to establish an electrical connection. The technique used by this disclosure is described by Figures 1 and 2 showing in more detail the heating element which is inserted into the tubular cavity of the bonding tool 1. The heating element 2 is connected to the external electrical wires 3 via miniature metallic tubings 4 which are crimped at 5 to insure a reliable electrical connection. The sub-assembly shown in Figure 2 is insulated by a suitable coating (aluminum oxide) and potted inside the cavity of bonding tool 1 (Figure 1) with a suitable thermally conductive ceramic compound 6.

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Thermally Enhanced Ultrasonic Wire Bonding

      Disclosed is a method to heat an ultrasonic wire bonding tool
to enhance the weld quality between the members to be joined; in this
particular case we refer to the joining of a wire to a substrate
surface which is used to establish an electrical connection.
     The technique used by this disclosure is described by Figures 1
and 2 showing in more detail the heating element which is inserted
into the tubular cavity of the bonding tool 1.
     The heating element 2 is connected to the external electrical
wires 3 via miniature metallic tubings 4 which are crimped at 5 to
insure a reliable electrical connection.
     The sub-assembly shown in Figure 2 is insulated by a suitable
coating (aluminum oxide) and potted inside the cavity of bonding tool
1 (Figure 1) with a suitable thermally conductive ceramic compound 6.

Disclosed Anonymously.