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Browse Prior Art Database

Optimum Utilization of Lithographic Exposure Field

IP.com Disclosure Number: IPCOM000104033D
Original Publication Date: 1993-Feb-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 44K

Publishing Venue

IBM

Related People

Gut, GM: AUTHOR [+2]

Abstract

Disclosed is a very significant improvement in utilization of the exposure field of a semiconductor stepper exposure camera. The technique described enables the manufacturing of larger chips with a given stepper than would otherwise be possible.

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This is the abbreviated version, containing approximately 60% of the total text.

Optimum Utilization of Lithographic Exposure Field

      Disclosed is a very significant improvement in utilization of
the exposure field of a semiconductor stepper exposure camera.  The
technique described enables the manufacturing of larger chips with a
given stepper than would otherwise be possible.

      It is proposed by this disclosure that the perimeter of
semiconductor chips should be altered to more closely match the
stepper exposure field used in their production.  Specifically, by
adding additional sides to the polygon formed by the perimeter of a
semiconductor chip one can more fully utilize the available stepper
exposure field.  This increase in chip area linearly increases the
maximum number of functional circuits that can be placed on the chip
and therefore increases the integration level of the intended
product.

      The following table details the increase in area as the number
of chip edges in increased.  These values assume equal length
perimeter segments (regular polygons) but any closed polygon with >4
sides yields a significant increase in stepper field utilization:

Number of chip sides      area multiplier
      4                      1.00
      6                      1.30
      8                      1.41
     12                      1.50
     24                      1.55
  infinite         ...