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Adhesion Durability Enhancement of Metal.BPDA-PDA Polyimide by O2,N2, Plasma Treatment

IP.com Disclosure Number: IPCOM000104040D
Original Publication Date: 1993-Feb-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 1 page(s) / 16K

Publishing Venue

IBM

Related People

Callegari, A: AUTHOR [+6]

Abstract

Disclosed is a process which enhances the adhesion durability of metal/BPDA-PDA polyimide under thermal exposure. It uses an O .sub 2, N .sub 2 plasma treatment of the polyimide prior to the metal deposition. After extensive thermal exposure which includes 10 polyimide cures at 400ºC and 1000 hours in T&H (85ºC 80% humidity) peel strengths were still &app.50 g/mm. This value is acceptable for manufacturing package parts for computer chips.

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Adhesion Durability Enhancement of Metal.BPDA-PDA Polyimide by O2,N2, Plasma Treatment

Disclosed is a process which enhances the adhesion durability of
metal/BPDA-PDA polyimide under thermal exposure.  It uses an O .sub
2,  N .sub 2 plasma treatment of the polyimide prior to the metal
deposition.  After extensive thermal exposure which includes 10
polyimide cures at 400ºC and 1000 hours in T&H (85ºC 80%
humidity) peel strengths were still &app.50 g/mm.  This value is
acceptable for manufacturing package parts for computer chips.

Disclosed Anonymously.