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Prevention of Dicing Debris by Polyimide Surface Cure

IP.com Disclosure Number: IPCOM000104062D
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Nakao, M: AUTHOR

Abstract

Disclosed is a pretreatment for dicing of a wafer which has a plasma processed polyimide passivation film on its top surface. Curing of the plasma-treated polyimide file before dicing is effective to prevent electrostatic charge build-up and debris deposition.

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Prevention of Dicing Debris by Polyimide Surface Cure

      Disclosed is a pretreatment for dicing of a wafer which has a
plasma processed polyimide passivation film on its top surface.
Curing of the plasma-treated polyimide file before dicing is
effective to prevent electrostatic charge build-up and debris
deposition.

      Flourine plasma process used for wafer cleaning and other
purposes makes the polyimide surface hydrophobic.  It is well known
that the hydrophobic polyimide surface easily gets charged in dicing
process with de-ionized water.  Charge build-up in the dicing process
results in breakdown of the gate dielectric, deposition of dicing
debris to the bonding pad regions and corrosion of the bonding pads,
causing serious problems with respect to device reliability.

      To prevent such problems, the present scheme proposes to cure
the plasma processed polyimide film before wafer dicing to to change
the polyimide surface from hydrophobic to hydrophilic.  The
hydrophilic polyimide surface is wettable enough to prevent charge-up
of the surface in the dicing process with de-ionized water.