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Liquid Impingement Component Cooling

IP.com Disclosure Number: IPCOM000104222D
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2005-Mar-18
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Johnson, CW: AUTHOR [+3]

Abstract

Described is a method of removing heat densities from components in excess of those densities that could be removed with normal forced air and some other liquid cooling techniques. Liquid is referenced throughout, and any liquid with suitable heat transfer characteristics can be employed.

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This is the abbreviated version, containing approximately 100% of the total text.

Liquid Impingement Component Cooling

      Described is a method of removing heat densities from
components in excess of those densities that could be removed with
normal forced air and some other liquid cooling techniques.  Liquid
is referenced throughout, and any liquid with suitable heat transfer
characteristics can be employed.

      The technique employs a heatsink, a reservoir and appropriate
forced liquid.

      Liquid is supplied through one or more of the inlets (depending
on amount of heat to be removed).  These inlets are depicted in Figs.
1 and 2.  Arrows represent the liquid flow paths.  The liquid
impinges on the exposed parallel fins and flows through the channels
created by the parallel plates or fins.  The fins are alternately
sloped in the inlet area to allow the liquid sufficient area to
spread.

      The component/module is attached to the COMPONENT MOUNTING
SURFACE.  Generated heat is conducted to the heatsink and transported
away by the inpinged liquid.  The liquid is then directed to a heat
exchanger where heat is removed from the liquid.

      Removal of heat is governed by the amount of liquid flow as
well as the thermal characteristics of the liquid and the method of
component attachment.