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Browse Prior Art Database

Solderable Metallized Polymer Isolation Pads

IP.com Disclosure Number: IPCOM000104267D
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 1 page(s) / 30K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR [+5]

Abstract

This disclosure describes the use of metallized polymer film to solve the problem of lost or missing isolation pads. Typically adhesively bonded isolation pads lose adhesion during build operations or field usage and are lost from the circuit card pattern. Fig. 1 shows the metallized polymer isolation pad 1 with polymer layer 5 and metal layer 6. The isolation is soldered to circuit card pad 2. This circuit card pad 2 has predeposited solder, in this case. The Leadless Chip Carrier component (LCC) or other surface mount device is aligned such that the connection pads 4 are placed over board circuit pattern. The device is then soldered to the card. Fig. 2 shows that final configuration, with the LCC 1, soldered to the card pads 4 via solder joints 2.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Solderable Metallized Polymer Isolation Pads

      This disclosure describes the use of metallized polymer film to
solve the problem of lost or missing isolation pads.  Typically
adhesively bonded isolation pads lose adhesion during build
operations or field usage and are lost from the circuit card pattern.
Fig. 1 shows the metallized polymer isolation pad 1 with polymer
layer 5 and metal layer 6.  The isolation is soldered to circuit card
pad 2.  This circuit card pad 2 has predeposited solder, in this
case.  The Leadless Chip Carrier component (LCC) or other surface
mount device is aligned such that the connection pads 4 are placed
over board circuit pattern.  The device is then soldered to the card.
Fig. 2 shows that final configuration, with the LCC 1, soldered to
the card pads 4 via solder joints 2.  The intercon nection pad 3 is
electrically isolated from the circuit card pad 4.  The detail of the
isolated pad 3 shows the isolations polymer insulating layer 5 and
the metal layer 6.  The metal layer 6 is soldered to the circuit card
pad 4 via the solder fillet 6.

Disclosed Anonymously.