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Enhanced One-Shot Plastic Molding by Providing Thermal, Structural and Environmental Protection of Critical Components

IP.com Disclosure Number: IPCOM000104349D
Original Publication Date: 1993-Apr-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Crosby, EG: AUTHOR [+4]

Abstract

This disclosure describes the application of state of the art materials and processes to produce a single shot plastic molded connector. This technique allows a fragile temperature sensitive sub-assembly to be used and converted into a rugged plastic part that is dimensionally stable.

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This is the abbreviated version, containing approximately 61% of the total text.

Enhanced One-Shot Plastic Molding by Providing Thermal, Structural and Environmental Protection of Critical Components

      This disclosure describes the application of state of the art
materials and processes to produce a single shot plastic molded
connector.  This technique allows a fragile temperature sensitive
sub-assembly to be used and converted into a rugged plastic part that
is dimensionally stable.

      Typical injection molding materials melt in the 300-600ºF
range, hence, soldered connections are reliability exposure during
the molding process.  During injection molding, attached fine wires
are exposed to high pressures from the plastic as it is being
injected, presenting a dimensional stability or termination failure
problem.

      In this assembly, a commercial UV sensitive polymer is applied
over the wire to PC board junction and into the fine wires
themselves.  The polymer curing is done in 5-10 seconds making it
ideal for inline production.  This polymer, when cured, provides a
sufficient thermal barrier to prevent the solder from melting and
structurally supports the fine wires during molding.

      With suitable support and sealoff techniques in our
experimental mold, we have demonstrated the ability to protect
delicate components reliability concerns on melting of the solder.
The development includes gating arrangements to reduce non-symmetric
pressures and balanced reduction in air pockets of the bulk cable to
maintain impedance...