Browse Prior Art Database

Spin Dryer Completion-Detection System

IP.com Disclosure Number: IPCOM000104398D
Original Publication Date: 1993-Apr-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Inoue, Y: AUTHOR [+2]

Abstract

Disclosed is spin dryer completion system which detects the moisture concentration in the spin dryer chamber to determine the finish of wafer drying process. The objective is: a) to prevent the wafer from charging up by the excessive drying; and b) to determine the drying time automatically in any surface state of wafer.

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Spin Dryer Completion-Detection System

      Disclosed is spin dryer completion system which detects the
moisture concentration in the spin dryer chamber to determine the
finish of wafer drying process.  The objective is: a) to prevent the
wafer from charging up by the excessive drying; and b) to determine
the drying time automatically in any surface state of wafer.

      Fig. 1 shows the schematic diagram of this system.  At first,
the exhaust air is inhaled by the pump unit 1.  The amount of
moisture in the air is measured by moisture concentration meter 2.
Measured values are sent to CPU 3 of Spin dryer, displayed and
analyzed.

      Fig 2.  shows the relationship between the moisture
concentration and wafer drying time.  The moisture concentration in
the exhaust air increases quickly at the first step of the wafer
drying process.  As the wafer drying process is proceeded, the
moisture concentration decreases gradually.  When the moisture on the
wafer surface is removed, the amount of moisture shows constant
value.  This point is defined as the endpoint (completion) of the
drying process.