Browse Prior Art Database

Module Handling Process

IP.com Disclosure Number: IPCOM000104477D
Original Publication Date: 1993-Apr-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Albrecht, JM: AUTHOR [+2]

Abstract

In this disclosure a method is described to conveniently remove the modules from the slide-equipped module carrier tube (Figure 1), while minimizing the risk of causing ESD damage.

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This is the abbreviated version, containing approximately 100% of the total text.

Module Handling Process

      In this disclosure a method is described to conveniently remove
the modules from the slide-equipped module carrier tube (Figure 1),
while minimizing the risk of causing ESD damage.

This process is as follows:

o   Attach a suction device to the bottom of any one of the many
    modules that may be within the slide.

o   Lift the suction device to remove the module from the slide.

o   If required, another suction device can be attached to the top of
    the module while the bottom suction device is released.

o   Place where needed within the manufacturing process or a test
    station.

o   Remove the suction device from the module.

      The advantage to this process is that all non-controlled
handling of the module is removed thereby minimizing the risk of ESD
damage.