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Low-Stress Frame Attachment for Thin Film Transfer

IP.com Disclosure Number: IPCOM000104535D
Original Publication Date: 1993-Apr-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 1 page(s) / 36K

Publishing Venue

IBM

Related People

Babich, E: AUTHOR [+5]

Abstract

Materials and process option by which a low stress attachment of a frame to metal/polymer thin film decal structures on carriers is disclosed for use in thin film transfer applications. The frame is made of a material which is matched with the substrate from which the decal is transferred as far as thermal expansion coefficient (TCE) is concerned to minimize thermal stresses and distortion generated during frame attachment. Additionally, the frame material is transparent to a range of ultraviolet (UV) radiation wavelengths. This latter aspect allows the use of UV curable adhesives, such as those containing gamma-aminopropyl and naphthoquinonediazo groups, as the means of attaching the frame to the thin films on its carrier.

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Low-Stress Frame Attachment for Thin Film Transfer

      Materials and process option by which a low stress attachment
of a frame to metal/polymer thin film decal structures on carriers is
disclosed for use in thin film transfer applications.  The frame is
made of a material which is matched with the substrate from which the
decal is transferred as far as thermal expansion coefficient (TCE) is
concerned to minimize thermal stresses and distortion generated
during frame attachment.  Additionally, the frame material is
transparent to a range of ultraviolet (UV) radiation wavelengths.
This latter aspect allows the use of UV curable adhesives, such as
those containing gamma-aminopropyl and naphthoquinonediazo groups, as
the means of attaching the frame to the thin films on its carrier.
Frame attachment can be accomplished by applying the adhesive to the
surfaces to be joined and exposing the same to UV radiation through
the UV transparent frame, thus curing and cross linking the adhesive
to form a robust joint.  Optional low temperature thermal curing can
be used if necessary to supplement the setting of the joint.  Such a
frame attachment scheme, either by a non-thermal photoprocess or at
worst a photoprocess supplemented by a very low temperature cure
cycle in combination with a TCE matched frame will lead to much
reduced stresses and distortions in the thin film decal upon removal
from the carrier for further use.

Disclosed Anonymously.