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Browse Prior Art Database

Thin Film on Card

IP.com Disclosure Number: IPCOM000104536D
Original Publication Date: 1993-Apr-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 1 page(s) / 22K

Publishing Venue

IBM

Related People

Narayan, C: AUTHOR [+3]

Abstract

To enhance the computing power of work stations and other desk top systems it is necessary to develop packaging technology to provide high density interconnections in Multi-chip-modules (MCMs) in a cost effective manner. While the card technology serves the consumer electronics market and the ceramic package satisfies the high performance systems, there is a need to increase the wireability of the card without significant additional cost. This invention teaches laminating thin film structures to cards either over the whole surface or over selected areas. The thin film structures are built on temporary carriers or frames and later transferred to the card. Such a composite structure will permit attachment of electronic chips directly to the top surface of the card.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Thin Film on Card

      To enhance the computing power of work stations and other desk
top systems it is necessary to develop packaging technology to
provide high density interconnections in Multi-chip-modules (MCMs) in
a cost effective manner.  While the card technology serves the
consumer electronics market and the ceramic package satisfies the
high performance systems, there is a need to increase the wireability
of the card without significant additional cost.  This invention
teaches laminating thin film structures to cards either over the
whole surface or over selected areas.  The thin film structures are
built on temporary carriers or frames and later transferred to the
card.  Such a composite structure will permit attachment of
electronic chips directly to the top surface of the card.

Disclosed Anonymously.