Browse Prior Art Database

Improvement for Electro Static Discharge Characteristics

IP.com Disclosure Number: IPCOM000104553D
Original Publication Date: 1993-May-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Kajita, T: AUTHOR [+3]

Abstract

Disclosed is a method for improving ESD (Electro Static Discharge) characteristics of information processing equipment by ESD bottom plate which is made of aluminum and covers the target machine's bottom area.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 72% of the total text.

Improvement for Electro Static Discharge Characteristics

      Disclosed is a method for improving ESD (Electro Static
Discharge) characteristics of information processing equipment by ESD
bottom plate which is made of aluminum and covers the target
machine's bottom area.

      Target machine 1 is a floor standing unit that has a metallic
enclosure.  As illustrated in the drawing, the target machine has a
ESD bottom plate 2.  The effective conditions are as follows:

1.  ESD bottom plate 2 should be aluminum alloy plate which covers
    the target machine's bottom area.

2.  ESD bottom plate 2 should have contacting points to the frame
    ground of the target machine 1 as many as possible.

3.  ESD bottom plate 2 should be placed to the floor surface as close
    as possible.

4.  The target machine 1 must be installed on metallic raised floor
    or compound metallic raised floor 3 (plastic covered metallic
    floor sheet).

      Conventional ways to improve ESD characteristics are to protect
signal lines against ESD with a shielding, a internal plane, or
metallic cover.  Those ways often require a considerable amount of
design change, and as a result, the cost of the target machine gets
higher.  Moreover, if the target machine has a sensitive signal line
(for example, channel cable), those measures are not efficient.   The
power cord ground line carries ESD current to main ground of the
building.  However, if the impedance of power co...