Browse Prior Art Database

Alternate Polyimide/Metal Thin Film Packaging Structure

IP.com Disclosure Number: IPCOM000104604D
Original Publication Date: 1993-May-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Shih, D: AUTHOR

Abstract

A major concern in fabricating a high density polyimide/metal thin film structure is the repeated large number of processing steps, which lead to long manufacturing time and yield loss. It is therefore necessary to reduce the processing steps so that the yield can be improved and the manufacturing time reduced.

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Alternate Polyimide/Metal Thin Film Packaging Structure

      A major concern in fabricating a high density polyimide/metal
thin film structure is the repeated large number of processing steps,
which lead to long manufacturing time and yield loss.  It is
therefore necessary to reduce the processing steps so that the yield
can be improved and the manufacturing time reduced.

      This disclosure proposes two structures which not only reduce
the manufacturing steps and time but, in the mean time, make the
multilevel wiring structore independent of the sintered Multilayer
Ceramic Module (MLC).  The first structure consists of using a
carrier made of ceramic, silicon or metal.  Both surfaces of the
carrier are simultaneously fabricated with one or two plane pair of
wiring/ground layers.  They are connected by the vias in the carrier.
With this approach many of the process steps such as PI curing,
ashing, plating, etc. can be simultaneously processed on both sides
of the carrier.  Some of the processes, if they can not be processed
simultaneously on both surfaces, may be processed by simply flip over
the carrier and processed sequentially.  The advantages of using this
approach are reduced processsing steps, handling and transportation,
in addition to better throughput and a more efficient usage of the
fabrication facility.  After the wiring patterns are fabricated on a
carrier, they can be tested before joining to the MLC, as illustrated
in the figure.

     ...