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Browse Prior Art Database

Method of Adding Devices to a Finished Circuit Card or Panel

IP.com Disclosure Number: IPCOM000104613D
Original Publication Date: 1993-May-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Duncan, SA: AUTHOR

Abstract

Engineering design changes to electronic cards and panels often require the addition of logic devices. Customarily, these devices are glued other devices on the card and connected with the circuits by wire. Disclosed is a method of using polymer thick materials to add device device patterns to finished electronic cards and panels undergoing engineering changes. A solderable copper polymeris printed in the form corresponding to the footprint of the device to be added. Polymer Thick Film is routed from existing positions on the electronic card or panel being reworked to the connections of copper polymer footprint. The new device to be added is then soldered to the copper polymer using normal industry assembly processes.

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This is the abbreviated version, containing approximately 100% of the total text.

Method of Adding Devices to a Finished Circuit Card or Panel

      Engineering design changes to electronic cards and panels often
require the addition of logic devices.  Customarily, these devices
are glued other devices on the card and connected with the circuits
by wire.  Disclosed is a method of using polymer thick materials to
add device device patterns to finished electronic cards and panels
undergoing engineering changes.  A solderable copper polymeris
printed in the form corresponding to the footprint of the device to
be added.  Polymer Thick Film is routed from existing positions on
the electronic card or panel being reworked to the connections of
copper polymer footprint.  The new device to be added is then
soldered to the copper polymer using normal industry assembly
processes.