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Method of Forming Gold Polymer Thick Film Contacts on Electronic Cards for High I/O Elements

IP.com Disclosure Number: IPCOM000104726D
Original Publication Date: 1993-May-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

Duncan, SA: AUTHOR

Abstract

This method uses polymer thick film material to form conductive patterns which are connected to Gold Conductive Polymers in a recessed hole to provide a self-aligning high I/O dry contact connector. Slightly recessed holes are constructed in the electronic card in much the same way as a Blind Via. These holes are filled with Gold Polymer Thick Film. Small contact points for the Gold Polymer Thick Film may be deposited matching a pattern on a flat flex cable. This corresponding pattern along with the recessed holes, would llow for alignment and would promote sealing of the contact area from environmental exposure.

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Method of Forming Gold Polymer Thick Film Contacts on Electronic Cards for High I/O Elements

      This method uses polymer thick film material to form conductive
patterns which are connected to Gold Conductive Polymers in a
recessed hole to provide a self-aligning high I/O dry contact
connector.  Slightly recessed holes are constructed in the electronic
card in much the same way as a Blind Via.  These holes are filled
with Gold Polymer Thick Film.  Small contact points for the Gold
Polymer Thick Film may be deposited matching a pattern on a flat flex
cable.  This corresponding pattern along with the recessed holes,
would llow for alignment and would promote sealing of the contact
area from environmental exposure.