Browse Prior Art Database

Improved Multi-Mode Cooling System

IP.com Disclosure Number: IPCOM000104841D
Original Publication Date: 1993-Jun-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 4 page(s) / 115K

Publishing Venue

IBM

Related People

Chrysler, TM: AUTHOR [+4]

Abstract

This article describes a new high performance cooling concept applicable to both the two-dimensional (planar) and three-dimensional (spatial) electronic packages common to high-end mainframes and supercomputers. This concept combines two known technologies, spring-loaded pistons and jet-impingement immersion cooling, to provide a highly reliable method for cooling high-power-density chips and power supplies.

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This is the abbreviated version, containing approximately 52% of the total text.

Improved Multi-Mode Cooling System

      This article describes a new high performance cooling concept
applicable to both the two-dimensional (planar) and three-dimensional
(spatial) electronic packages common to high-end mainframes and
supercomputers.  This concept combines two known technologies,
spring-loaded pistons and jet-impingement immersion cooling, to
provide a highly reliable method for cooling high-power-density chips
and power supplies.

      Two spatial packages providing high substrate packaging density
but catering to different power supply form factors are advanced.  A
spatial substrate configuration employing offset power supply modules
is shown in Fig. 1.  Dielectric coolant (i.e., 3M's Flourinert
family) is distributed to jet-impingement plenums 1 attached to each
substrate 2.  From the plenum 1, the coolant is supplied to the chips
through a unique jet-impingement piston device 3 (discussed later).
The coolant exhaust from the chip is further utilized as a heat sink
for the power supplies 4.  Coolant passes from the chips downward to
the vessel floor and then upwards through the power supply coolant
entrance 5.  Spent coolant then flows upward and out of the
jet-impingement overflow container 6 and out via the coolant return
plumbing.  The entire cooling apparatus thus described is enclosed in
a liquid-tight containment vessel 7 which has the appropriate
plumbing for the coolant supply 8 and return 9.  Internal to the
containment vessel 7 and above the liquid level is a water-cooled
condenser 10 to recondense any vapor produced at either the chips or
the power supplies.  The condenser 10 is connected to a chilled water
source through its own supply and return lines 11.  I/O...