Browse Prior Art Database

Composite Card to Provide Uniform Cooling to Single Chip Modules with Large Z Tolerance

IP.com Disclosure Number: IPCOM000104904D
Original Publication Date: 1993-Jun-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

Jordhamo, GM: AUTHOR [+2]

Abstract

Disclosed is a method that can be utilized to cool single chip modules mounted on a circuit card in which the large z tolerance would not otherwise afford the use of a simple, planar cold plate. When multiple modules are mounted onto a single card, a single planar cold plate will not contact all modules due to the tolerance build up with the associated card/module assembly. Typically, bellows or pistons are used to contact each individual module which are more complicated to manufacture than simple planar cold plates.

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This is the abbreviated version, containing approximately 74% of the total text.

Composite Card to Provide Uniform Cooling to Single Chip Modules with Large Z Tolerance

      Disclosed is a method that can be utilized to cool single chip
modules mounted on a circuit card in which the large z tolerance
would not otherwise afford the use of a simple, planar cold plate.
When multiple modules are mounted onto a single card, a single planar
cold plate will not contact all modules due to the tolerance build up
with the associated card/module assembly.  Typically, bellows or
pistons are used to contact each individual module which are more
complicated to manufacture than simple planar cold plates.

      The method described here utilizes a composite card to allow
the use of a planar cold plate for cooling.  The composite card
consists of a standard rigid printed circuit card in which one or
more of the internal layers has been replaced with a flexible
material such as Kapton*.  This flexible layer is laminated into the
card during card manufacture.  There are openings in the rigid card,
both on the top and bottom surfaces of the flex material in areas
where modules are to be attached.  In addition, the flex material in
these areas is preformed with a bend to allow for some movement or
flex in the z direction.  A cross section of the composite card is
shown in Fig. 1.  The number and location of flex regions is only
limited to what can be reasonably manufactured.

      To complete the assembly, some form of a spring assembly is
mounted on t...