Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

External Applique to Fix Board Power Planes

IP.com Disclosure Number: IPCOM000104960D
Original Publication Date: 1993-Jun-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Calabrese, GM: AUTHOR [+2]

Abstract

With the increase in circuit speeds and wiring densities, printed circuit boards and their power/ground structure play an increasing role in electrical performance.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 57% of the total text.

External Applique to Fix Board Power Planes

      With the increase in circuit speeds and wiring densities,
printed circuit boards and their power/ground structure play an
increasing role in electrical performance.

      This article describes a quick method of repairing internal
board defects by use of an external plane (applique).  The advantage
of using an applique is to provide a re-design prototype without the
time and expense of building actual boards.  The external plane can
be constructed out of copper clad epoxy, copper Kapton* flex circuits
of any other suitable printed circuit material.

      Board pin locations are drilled out through the applique
providing a footprint to fit over the board area being repaired.
Clearance holes can be milled or chemically etched out where pin
contact is not desired and left in place where there will be
electrical contact.  Using a chemical process allows for plated
through holes providing better reliability on the contact pins.  The
applique is then placed over the board and soldered into place,thus
completing the electrical fix.

      The following items give an idea of the flexibility and
benefits of using an external applique.

1.  The applique provides an alternate path for directing current
    flow.  This has been successfully used as a fix for coupling
    problems due to common ground inductance.
2.  The applique can be used to gain additional wiring density on the
    board.  Several la...