Browse Prior Art Database

Simple Packaging Integrity Test

IP.com Disclosure Number: IPCOM000105150D
Original Publication Date: 1993-Jun-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 82K

Publishing Venue

IBM

Related People

Chiang, S: AUTHOR [+3]

Abstract

Disclosed are test methods and test apparatuses for the evaluation of electronic component package via integrity. Liquid is drawn into the package via crack or weak interface under the influence of ambient pressure. Electrical leakage current or isolation resistance can be measured after a wash and dry processes.

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This is the abbreviated version, containing approximately 52% of the total text.

Simple Packaging Integrity Test

      Disclosed are test methods and test apparatuses for the
evaluation of electronic component package  via  integrity.  Liquid
is drawn into the package via crack or weak interface under the
influence of ambient pressure.  Electrical leakage current or
isolation resistance can be measured after a wash and dry processes.

      Plastic packaging for electronic components, such as
semiconductor chips, capacitors, etc., should provide protection
against moisture and solvent attack in the card assembly processes
and use environments.  Otherwise, corrosion, electrical leakage, or a
short could be developed and cause equipment failure.  Because of
thermal expansion mismatch, and/or poor  adhesion,  cracking,
separation,  or delamination could occur and degrade package
integrity.  It is essential to have a test method and apparatus  to
assist the  development of plastic package material and process,
monitor assembly processes, and assure product quality.  Some common
methods being used are dye penetration followed by cross sectioning,
ultrasonic scan, helium detection, etc.  These methods are either
destructive  or  nonfunctional  and may have no connection to the
failed component.

      A generic test method is disclosed in which components are
exposed to vacuum, then water or other liquid, followed by rinse,
dry, and an electrical leakage  current measurement.  Some examples
of liquids are:  deionized water, water, water with a wetting agent,
acid, salt water, cleaning solvent, flux, etc.  Liquid infiltration
into  the components  can  be  achieved  by  either  of  the
following methods:   1).  Expose the  components  in  a  vacuum  for
a certain  period  of  time.    Before  or after returning the
component...