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Laser-Induced Forward Transfer of Electroless Seed Layers

IP.com Disclosure Number: IPCOM000105182D
Original Publication Date: 1993-Jun-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

O'Sullivan, EJ: AUTHOR [+3]

Abstract

A process is disclosed for depositing (patterned) seed layers for subsequent electroless plating which is rapid, capable of high spatial resolution, does not require photoresist masking, and is capable of effectively seeding both horizontal and vertical surfaces of the workpiece.

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This is the abbreviated version, containing approximately 61% of the total text.

Laser-Induced Forward Transfer of Electroless Seed Layers

      A  process  is  disclosed  for  depositing  (patterned) seed
layers for subsequent electroless plating  which  is  rapid, capable
of  high  spatial  resolution,  does  not  require photoresist
masking, and is capable of  effectively  seeding both horizontal and
vertical surfaces of the workpiece.

      A  thin  layer of Pd or other suitable seed material is
deposited on the workpiece of interest by the laser  induced forward
transfer  (LIFT)  techniqubotlbrk.*].  The LIFT technique employs a
pulsed  laser  to  deposit  material,  previously coated  on  a
transparent support, from that support to the workpiece.   Projection
or contact  masks  can  be  used  to define  the  pattern  of  the
transferred material.   If the material is  transferred  onto  a
workpiece  with  vertical surfaces,  sufficient  coverage  is
obtained  to  provide a continuous seed layer along the  vertical
surfaces.    Thin layers of high thermal conductivity materials (
metals ) are transferred  as  a  high  velocity vapor, with a
significant degree of ionization, producing excellent  adhesion  to
the substrate.   Subsequent to the deposition of the seed layer,
standard electroless solutions may be employed to affect the
deposition of a thick overlayer.

      Such vertical surfaces would include the  sidewalls  of blind
via  or  contact  holes  in  integ...